Cooler para CPU de servidor COOLSERVER R63 2U com 4 heatpipes, compatível com Intel LGA2011 1700 115X e AMD AM4.

The CPU base size of R63-1 LGA2011 is 80*80mm, and the CPU base size of R63 LGA2011 is 94*56mm. LGA 2011-R63-1 specifications Brand: COOLSERVER Product model: LGA 2011-R63-1 CPU type: LGA 2011 (square motherboard) Voltage: 12V Product size: L90*W90*H65mm Fan speed: PWM 3000-6800RPM Noise level: 49.4dBA (MAX) Air volume: 34. 74CFM (MAX) Fan plug: 4pin PWM Bearing type: double ball CPU hole distance: 80*80mm Material: aluminum fins + 4 heat pipes Power consumption: 165W LGA 2011-R63 specifications Brand: COOLSERVER Product model: LGA 2011-R63 CPU type: LGA 2011 (rectangular motherboard) Voltage: 12V Product size: L90*W90*H65mm Fan speed: PWM 3000-6800RPM Noise level: 49.4dBA (MAX) Air volume: 34. 74CFM (MAX) Fan plug: 4pin PWM Bearing type: double ball CPU hole distance: 94*56mm Material: aluminum fins + 4 heat pipes Power consumption: 165W LGA 1700-R63 specifications Brand: COOLSERVER Product model: LGA 1700-R63 CPU type: LGA 1700 (square motherboard) Voltage: 12V Product size: L90*W90*H65mm Fan speed: PWM 3000-6800RPM Noise level: 49.4dBA (MAX) Air volume: 34. 74CFM (MAX) Fan plug: 4pin PWM Bearing type: double ball CPU hole distance: 78*78mm Material: aluminum fins + 4 heat pipes Power consumption: 165W LGA 115X-R63 specifications Brand: COOLSERVER Product model: LGA 115X-R63 CPU type: LGA 115X (square motherboard) Voltage: 12V Product size: L90*W90*H65mm Fan speed: PWM 3000-6800RPM Noise level: 49.4dBA (MAX) Air volume: 34. 74CFM (MAX) Fan plug: 4pin PWM Bearing type: double ball CPU hole distance: 75*75mm Material: aluminum fins + 4 heat pipes Power consumption: 165W LGA AM4-R63 specifications Brand: COOLSERVER Product model: AMD AM4-R63 CPU type: AMD AM4 (rectangular motherboard) Voltage: 12V Product size: L90*W90*H65mm Fan speed: PWM 3000-6800RPM Noise level: 49.4dBA (MAX) Air volume: 34. 74CFM (MAX) Fan plug: 4pin PWM Bearing type: double ball CPU hole distance: 90*54mm Material: aluminum fins + 4 heat pipes Power consumption: 165W Using FIN and buckle FIN process 1. Between the radiator fin and the copper tube, the fin manufacturing process is adopted, and the fin and fin technology are combined to increase the surface heat dissipation area and stabilize the fin spacing. 2. The fins of the heat sink adopt fin technology not only to increase the firmness, but also to keep the spacing of each fin consistent. The airflow generated by the fan passes through each fin evenly and smoothly, thereby reducing wind cutting noise and enhancing heat dissipation. performance. Using 6025 fan Imported lc original components, silent, stable, strong wind, large air volume, fast and efficient heat dissipation